Technologies

CMOS Technology

CMOS Technology at Rayatec supports the design, prototyping, and evaluation of a wide range of digital, analog, and mixed-signal integrated circuits across mature and advanced technology nodes. Our services cover front-end and back-end design, verification, and fabrication access through established foundry partners. In addition, we provide structured testing and characterization support for silicon-based CMOS chips, including functional validation, parametric measurement, timing and power analysis for digital circuits, as well as noise, linearity, and signal integrity assessment for analog and mixed-signal designs. Through coordination with qualified international test facilities, we assist clients in wafer-level and package-level evaluation, helping ensure design consistency with process specifications and reliable performance before volume production or system integration.

Low Power
High Density
Scalable

GaN (Gallium Nitride)

Rayatec supports the development and industrialization of GaN-based semiconductor technologies for high-power, high-frequency, and harsh-environment applications. We provide technical coordination for device design, simulation, prototyping, and characterization, and facilitate access to international GaN foundries and packaging partners. Our services enable research institutions and industrial teams to transition GaN power and RF device concepts into validated prototypes and scalable solutions for power electronics, RF systems, and next-generation communication infrastructures.

Wide-Bandgap
High-Voltage
Thermal-Robust

GaAs

Rayatec provides technical support and international access for the development of GaAs-based semiconductor devices, focusing on RF, microwave, and optoelectronic applications. We assist partners in device design, modeling, prototyping, and characterization, and coordinate fabrication and packaging through established global foundries and specialized service providers. Our network enables research groups and industrial teams to translate GaAs concepts into validated prototypes and application-ready components for communications, sensing, and high-frequency systems.

High-Frequency
Optoelectronic
RF-Ready

SiC

Rayatec supports the development and industrialization of SiC-based power semiconductor technologies by facilitating access to design expertise, device modeling, and international fabrication and packaging services. We assist research institutions and industrial partners in selecting appropriate SiC process platforms, coordinating device design and characterization, and interfacing with global foundries and packaging houses. Through our technical network, we enable prototyping, qualification, and system-level integration of SiC devices for power electronics, automotive, renewable energy, and high-voltage applications.

High-Voltage
Automotive-Grade
Thermal-Ready

InP

Rayatec supports the design, prototyping, and integration of Indium Phosphide (InP) technologies, a key material for high-speed optoelectronic devices, lasers, and photonic integrated circuits. Our services cover device design, process guidance, and access to international fabrication and testing partners, enabling clients to implement InP-based solutions efficiently. Through our network, research centers and industrial teams can accelerate development cycles, ensure reliable device performance, and bring high-frequency and photonic applications from concept to scalable production.

High-Speed
Photonic-Integrated
Laser-Ready

SiN

Rayatec offers comprehensive support for the development and integration of Silicon Nitride (SiN) technologies, widely used in photonics, MEMS, and dielectric applications. We provide assistance in device design, process optimization, prototyping, and characterization, while connecting clients with international fabrication and packaging partners. Our services enable research institutions and industrial teams to implement SiN-based photonic circuits, MEMS sensors, and dielectric layers efficiently, ensuring reliable performance and seamless transition from concept to scalable applications.

Low-Loss
High-Contrast
MEMS-Ready

SiGe

SiGe Technology at Rayatec offers a robust platform for the development of high-performance RF and microwave integrated circuits. Leveraging the advantages of silicon-germanium, our services enable enhanced carrier mobility, low-noise operation, and reliable performance at high frequencies. We support international clients throughout the entire process—from design and simulation to prototyping and access to trusted foundries—facilitating the development of SiGe-based solutions for applications in wireless communications, radar systems, satellite links, and advanced sensor technologies.

High-Frequency
Low-Noise
High-Mobility

Photonics

Rayatec provides access and technical coordination for photonic and silicon photonics design and prototyping services. We support the development of photonic integrated circuits (PICs) and optoelectronic components by facilitating design workflows, technology selection, and access to international photonics foundries. Our services include coordination for MPW prototyping, integration of photonic and electronic circuits, and support for testing and packaging pathways. By leveraging international partnerships and local technical networks, Rayatec enables research institutions and industrial partners to transition photonic concepts into functional prototypes and system-level demonstrators.

Photonic-Integrated
Silicon-Photonics
MPW-Ready

MEMS

Rayatec supports the development of Micro-Electro-Mechanical Systems (MEMS) through access to design, prototyping, and fabrication pathways for sensing and actuation applications. Our services cover MEMS device design support, process technology selection, and coordination with international MEMS foundries for prototype fabrication. We facilitate the integration of MEMS with CMOS electronics and packaging solutions, enabling research groups and industrial partners to develop functional microsystems for sensing, communication, biomedical, and industrial applications. Through international supply chain and technical partnerships, Rayatec provides a structured route from MEMS concept design to validated prototypes and system-level integration.

Sensing-Actuation
CMOS-Integrated
Microsystems-Ready